The Empty is a fundamental element in the manufacture of semiconductors, because it allows control the production environment with extreme precision silicon wafers. By drastically reducing the pressure and the presence of residual gases, Vacuum limits particulate and chemical contaminations, which are essential to reach nanoscale modern electronic components.
In clean rooms, the Void is used to create controlled environments during a number of critical steps: thin film deposition (PVD, CVD, ALD), plasma engraving, ion implantation, annealing under controlled atmosphere and automated wafer transfer between the various process modules. The Void also allows stabilize plasmas, to ensure a uniformity of deposits, and to guarantee the repeatability of processes, essential criteria for the efficiency and reliability of integrated circuits.
Finally, the Void plays a key role in touchless handling wafers, via vacuum gripping systems, thus reducing mechanical risks and surface defects.
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